Thermal Gap Pads
Thermal Gap Pads
Thermal Conductivity:1.0w/m.k
High conformable at low stress application
Breakdown voltage:>4KV
SGS/UL
Themal Gap Pads
Features&Benefits:
2. High conformability and cost effectiveTypical Application:-LED Lighting -Power Supply -Power conversion
-Low power modules,like NB and DT memory
-Between semiconductor/magnetic components and heat sinks
Configurations:
-Roll form,sheet form,precut sizes
-Tape application available
Size available:
Sheet size:200x400mm
Thickness available:
0.25mm,0.3mm,0.5-18.0mm,increment by 0.5mm
Properties:
Typical Properties of Gap Pad LD8100 | |||
Property | Unit | Metric Value | Test Method |
Color | *** | White Grey | Visual |
Thickness | mm | 0.3~12.0 | ASTM D374 |
Density | g/cc | 1.8 | ASTM D792 |
Hardness | Shore C | 30±5 | ASTM D2240 |
Tensile Strength | KN/m | 0.85 | ASTM D412 |
Continuous Use Temp. | °C | -40-150°C | EN 344 |
Electrical | |||
Breakdown Voltage | Kv/mm | ≥6.0 | ASTM D149 |
Volume Resistivity | Ω.cm | 1.2x1011 | ASTM D257 |
Flame rating | V-0 | V-0 | UL 94 |
Thermal | |||
Thermal Conductivity | W/m.k | 1.0 | ASTM D5470 |
