Thermal gap filler pad
Thermal gap filler pad
Good thermal insulation material
Soft and cost effective solution
Low stress application
Thermal gap filler pad
Features&Benefits:
-Thermal conductivity:1.2w/m.k
-Moderate tacky on both sides
-High softness offer high conformability at low stress application
-Electrical isolating
Typical Application:
-Flat panel display
-handheld devices
-Telecommunication
-Mid to high power module
Configurations:
-Sheet form,die-cut parts
-Tape application available
Size available:
200x400mm
Thickness available:
1.0-12.0mm,increment by 0.5mm
Properties:
Typical Properties of Gap Pad LD8120 | |||
Property | Unit | Metric Value | Test Method |
Color | *** | Light Red | Visual |
Thickness | mm | 1.0-12.0 | ASTM D374 |
Density | g/cc | 2.3 | ASTM D792 |
Hardness | Shore C | 15±5 | ASTM D2240 |
Tensile Strength | KN/m | 1 | ASTM D412 |
Continuous Use Temp. | °C | -40-150°C | EN 344 |
Electrical | |||
Breakdown Voltage | Kv/mm | ≥6.5 | ASTM D149 |
Volume Resistivity | Ω.cm | 3.5×1012 | ASTM D257 |
Flame rating | V-0 | V-0 | UL 94 |
Thermal | |||
Thermal Conductivity | W/m.k | 1.2 | ASTM D5470 |
For more details and application direction,welcome to contact our sales!
