Thermal pad
Thermal pad
Thermal conductivity:1.0w/m.k
RoHS and Reach Compliant
Cost effective solution power supply
SGS/RoHS/UL/Reach
Thermal Pad
Features&Benefits:-Thermal conductivity:1.0w/m.k
-Slightly tacky on both sides
-Conformable gap filler material at low stress application
-Electrical isolating
-Flame rating:V-0
Typical Application Includes:
-LED Lighting
-Power Supply
-Low power modules,like NB and DT memory
-Power conversion
-Between semiconductor/magnetic components and heat sinks.
Configurations:
-Roll form,sheet form,die-cut parts
-Tape application available
Size available:
Sheet size:200x400mm
Thickness available:
0.25mm,0.3mm,0.5-18.0mm,increment by 0.5mm
Properties:
Typical Properties of Gap Pad LD8100+F100 | |||
Property | Unit | Metric Value | Test Method |
Color | *** | Pink&White | Visual |
Thickness | mm | 0.5~15.0 | ASTM D374 |
Density | g/cc | 2 | ASTM D792 |
Hardness | Shore C | 15±5 | ASTM D2240 |
Tensile Strength | KN/m | 2.5 | ASTM D412 |
Continuous Use Temp. | °C | -40-150°C | EN 344 |
Electrical | |||
Breakdown Voltage | Kv/mm | ≥6.3 | ASTM D149 |
Volume Resistivity | Ω.cm | 6.2×1015 | ASTM D257 |
Flame rating | V-0 | V-0 | UL 94 |
Thermal | |||
Thermal Conductivity | W/m.k | 1.0 | ASTM D5470 |
For more details and application direction,welcome to contact our sales!
